Sorry for my English,
I got my LimeSDR mini, and before start to play with him I want to add some improvements.
I was buy aliminium case and want to put LimeSDR mini into this case, I see two things that may add additional stability:
- Screening from the noise for eliminate interference.
- Additional heatsink.
I am planning put in the case silicon thermal pad between aluminium case and LimeSDR mini, for heat transfer from PCB to case, of cource I also planning add heatsink to FPGA USB 3.0 and put silicon thermal pad between RF chip and screen and place heatsink at the screen.If it need I can add small fan for this construction.
Before to start all of this implement, I want to consult about this. First my question it the it is norml if I plase PCB directly at the thermal pad? For additional of protection from short circuit PCB components to the case, I planned isolate aluminium case bottom with help capton film.
I am already buy two thermal pad, one of this 2mm thickness, and another is 3.5mm thickness. I am want use thermal pad between case and PCB thickness 3.5mm, also I add spacer between case and PCB for eliminate contact between case and PCB and will fix with help screws.
Some photo of my components: