The traces on the left side would need to be repaired. The ones in the middle you would need to make sure they are NC, or not connected. It could be why they pulled up easy. The chip would have to be removed from the heat-sink. If you used cement adhesive, it would be a no go. In all likely hood I would consider the board totaled.
I do reflow profiling at work. Doing BGA lead-free would make me shutter. The chip leaving so many clean pads has me to believe there were many cold joints. Or the ENIG finish had oxidized a bit before processing. I was going to re-ball and re-flow the lime chip with lead but I honestly dont know how they flowed it as there is zero clearance between the chip and board. Presumably to keep rf out.
If I were lime I would request to see the reflow profile with the probe tracking and placement to ensure it’s in spec.