Hello,
We are building custom boards with LMS7002 but are having yield issues. The process is standard (pick and place then through a reflow).
May I ask you to please advise on any measures to ensure that the LMS7002 is soldered properly.
- Stencil thickness
- pad openings
- Reflow profile (specific to what kind of solder paste composition and number of layers of the PCB)
Regards,