# Heat: 3D-printed case with heatsinking and fan (w/ thermal analysis)

**URL:** <https://discourse.myriadrf.org/t/heat-3d-printed-case-with-heatsinking-and-fan-w-thermal-analysis/2066>\
**Category:** LimeSDR\
**Created:** [28 November 2017 09:45 UTC](https://discourse.myriadrf.org/t/heat-3d-printed-case-with-heatsinking-and-fan-w-thermal-analysis/2066 "2017-11-28T09:45:39Z")\
**Posts on this page:** 2\
**Page:** 1

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**Author:** ![marsupial67](https://yyz2.discourse-cdn.com/flex034/user_avatar/discourse.myriadrf.org/marsupial67/32/1956_2.png) [@marsupial67](https://discourse.myriadrf.org/u/marsupial67)\
**Post date:** [28 November 2017 09:45 UTC](https://discourse.myriadrf.org/t/heat-3d-printed-case-with-heatsinking-and-fan-w-thermal-analysis/2066/1 "2017-11-28T09:45:39Z")

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Hi everyone,

We designed a 3D-printed case with heatsinking and active cooling. The LimeSDR’s temperature went from 65°C down to 30°C while operating normally.

The full thermal analysis is available on [our blog](http://blog.reds.ch/?p=207).

If you want to try it out, you can print your own case using the files on our [Github repository](https://github.com/reds-heig/LimeSDR_case). There’s a full BOM listing properly-sized heatsinks, a DC fan, adhesive foil and SMA pigtails, with order links.

People following [Cooling recommendations?](https://discourse.myriadrf.org/t/cooling-recommendations/774) and [Heatsinking Your LimeSDR](https://discourse.myriadrf.org/t/heatsinking-your-limesdr/1091) may be interested.

Feedback is welcome :).

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**Author:** ![9a4db](https://yyz2.discourse-cdn.com/flex034/user_avatar/discourse.myriadrf.org/9a4db/32/2675_2.png) [@9a4db](https://discourse.myriadrf.org/u/9a4db)\
**Post date:** [28 November 2017 09:59 UTC](https://discourse.myriadrf.org/t/heat-3d-printed-case-with-heatsinking-and-fan-w-thermal-analysis/2066/2 "2017-11-28T09:59:06Z")

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Nice work.  
An extra tip may be to mount one metal (Al or Cu) oversized plate 1-2 mm thick,  
bellow Lime (you have nice space, left and right) and take more heat out of board  
either by mount edges or by 3-4 mm thick silicon thermal pad bellow.